Hili ni toleo la zamani. Toleo la sasa ni 5.5.3.8850. ideaMaker 5.5.3.8850 · Lilitolewa:
Faili za kisakinishi 5.2.3.8580
| Usanifu | Aina | Upeo | Ukubwa wa faili | Pakua | SHA256 |
|---|---|---|---|---|---|
| 64-bit | EXE (NSIS) | Watumiaji wote | 97.5 MB | downcdn.raise3d.com | VirusTotal |
Kiungo na SHA256 vinatoka kwenye manifest ya jumuiya ya Windows Package Manager. Linganisha hashi ya faili uliyopakua kabla ya kuiendesha.
Maelezo ya toleo
- Improved the tree support generation when using per-group settings.
- Reduced the memory consumption of support painting operations.
- Improved the gap filling algorithm to reduce the processing time.
- Improved the slicing algorithm to avoid contours missing on some parts of the models.
- Improved profiles for Hyper Core PPA CF, Hyper Core PPA GF and Hyper Core ABS CF materials for the Raise3D Pro3 HS Series.
- Improved profiles for Premium PLA and Premium ABS materials for the Raise3D Pro3 Series with Hyper Speed Kit.
- Add new ORP resin materials: Henkel LOCTITE 3D IND147 Black, Henkel LOCTITE 3D IND403 Black, Henkel LOCTITE 3D IND5714 Gray.
